A collection of tools for stepping, clipping, merging and viewing wafer level masks used for RDL and bumping of flip chips. Reduce the time to produce your mask set from hours to minutes.
Wirebond reduces the time required to create bond wire documents from hours to minutes. Imports the die, places it, wires it, wire DRC, separate wires by tier, auto-documentation. Runs inside of AutoCAD 2004/2008. Tagger is used to add intelligence to “dumb” leadframe and BGA drawings. Together the two programs accelerate the generation of bond documents for the factory floor.
SmartDie extracts pad coordinates and nets from a GDSII or AutoCAD dwg of the die. Builds a complete die netlist in seconds. Import the netlist into Wirebond, APD, Encore. Runs inside of AutoCAD 2004-2009. New! SmartDie is now available as a stand-alone application running as part of Artwork’s third generation GDSII viewer …
It is difficult to import a lead frame drawn in AutoCAD into Cadence APD but now it can be done in minutes using the two modesl of ACAD2APD – LayoutGen to add intelligence within AutoCAD and Layout2APD to import the data into APD …
AIF is a simple, open, text based data exchange format developed by Artwork together with Cadence and Xynetix, and users such as Amkor, Xilinx, AMD and Agere … which is very useful for wirebond data exchange.
Reads an ASCII list and import it into Excel for product engineers who need to document a BGA’s layout. The Ballmap program creates a cell for each ball pad. The signal name of the ball pad is listed in the center of the cell and the JEDEC labels are arranged outside the array.
Aligning a Wafer Map Using Shot Map Parameters When building an RDL mask set the package designer would like to use the wafer map as a template. This software not only converts the wafer map but uses the shot map parameters to align the layout onto the wafer …
3DVU is a 3D Viewer and DRC checker for both simple and advanced packages …It can be used to visualize complicated packages in 3D and also to check wire clearances in full 3D. Additional modules for 3Di to STEP conversion available.
Automatically generate a bond wire documentation package in minutes from a new design done in Cadence APD or Xynetix Encore BGA (Now Sigrity.) Bondgen extracts the pads, wires, die and rings from a completed design (via the AIF format)and automates the layout, labeling and annotation of the bond document. Runs inside of AutoCAD 2004-2009.
Documentation Generator for BGA Substrates. Helps generate a multi-page documentation package inside of AutoCAD. Customized for each company’s title border and documentation requirements. Runs in AutoCAD 2007-2013.
Our package design tool wizard and protoyper running inside of AutoCAD 2000 to 2009. Optimized for design of PBGA, SBGA, TAPE and HPBGA parts. Ideal for preliminary design of very dense staggered die and multi-ring packages; Interface to Cadence APD.
A utility for quickly and efficiently generating full wafer masks for semiconductor and RDL packaging. Includes support for reticle input, replacing die, knockouts and SINF (wafer map) output.
A utility for reading a number of wafer map formats and converting to SINF, DXF and GDSII. Ideal for RDL mask designers who need precise location information of the devices on the wafer.
A utility for accepting the input data describing a reticle shot map and converting it into GDSII or DXF layout formats …