Key Benefits
Chip / Package Co-Design
Create higher performing, lower cost packages
Multi-Chip(let) Design
Robust support for multi-chip(let) heterogeneously integrated designs
Comprehensive Design
Analysis and verification flow for fan-out wafer-level package (FOWLP)
Reference Flows
Support for major foundry and OSAT advanced packaging
Why choose Isograph's Reliability Workbench?
There are many reasons to choose Reliability Workbench – here are
just a few:
Product Catagories
IC Package Design
Constraint-driven correct-by-construction package substrate layout
Cross-Platform Co-Design and Analysis
Direct integration with Virtuoso® and Innovus™ IC flows
Multi-Chip(let) Design
Complete front-to-back design-through-verification flow
SI/PI Analysis
Advanced integrated PI and power-aware SI tools to ensure better design performance
SI/PI Analysis Point Tools
Signal integrity analysis with signoff-level accuracy
Solutions
Cross-Platform
Cross-platform interconnects unify IC, package, and PCB data to easily derive and evaluate signal-to-bump/ball-assignment and connectivity/routing-pathway scenarios.
3D-IC
Our 3D-IC solution reduces power, raises performance, and enables maximum functionality in a smaller form factor.
FOWLP
Our FOWLP flow shortens your design and verification cycle and increases system bandwidth while decreasing power consumptionCross-Platform/Cross-Domain Multi-Chip(let)
Our cross-platform/cross-domain multi-chip(let) packaging flow provides a unified “system-aware” platform for concurrent design across chip, package, and board
Harness the potential of your entire design and engineer teams to solve the most complex design challenges. Collaborate across the wall, across design domains, on a single design or a complex multi-board PCB system. Track your design projects to success as design rules and design goals are established and met.
Key Benefits
In-Design
Analysis
Simulate early, simulate often
Multi-Board PCB Systems
Simplify the complex
Real-Time Collaborative Design
Build your teamwork
Product Catagories
Front-End Schematic Capture
Easy-to-use system architecture planning and schematic capture environment.
Back-End Board Layout and Routing
Complete rules-based real-time PCB layout and routing environment
Library and Design Data Process Management
Manage a shared library of parts, symbols, and footprints to reduce time and errors
Analog/Mixed-Signal Simulation
Accurate modeling, design optimization, and validation to ensure functionality
SI/PI Analysis
Accurate modeling, design optimization, and validation to ensure functionality
SI/PI Analysis Point Tools
Signal and power integrity analysis with signoff-level accuracy
Solutions
Multi-Board PCB System Design
Ensure connectivity and eliminate unnecessary system re-spins in your multi-board designs.
PDN Design
Team-based constraint-driven PDN design flow for efficient communication between PCB designers and PI engineers
3D System Design Solutions
Visualize your complex high-speed systems and simulate signal integrity for signal and return paths to dies, packages, and PCBs as well as connectors, cables, sockets, and other mechanical structures.
IC/Package/PCB Co-Design
Ensure shorter cycles times designing high-performance interfaces with cross-domain planning in a single design tool.
Technologies
Industry-leading technology to solve the challenges that excite your creativity
Allegro Right First-Time Design
Avoid late-stage design changes and reworks with real-time design rule verification while you design
Allegro TimingVision Environment
Real-time visual feedback and detect timing issues right on your routing canvas
Augmented Reality Lab Tools
Accelerate inspection, debug, rework, and assemble PCBs in less time, without mistakes or frustration with augmented reality
Constraint-Driven PI Signoff
Ensure the power delivery network (PDN) constraints are being met so you can get your designs done faster and with less stress at signoff
Constraint-Driven PCB Layout
The constraint-driven design architecture provides a common, consistent system for creation, management, and validation of constraints from front to back to eliminate unnecessary iterations and cut your design cycle by weeks
Power-Aware Signal Integrity Analysis
Complete power-aware design and SI analysis solution ensures the entire design team understands all the signal integrity design considerations
Interface-Aware Approach
Hierarchical interface-aware approach to accelerate your PCB design authoring and implementation process—and increase design quality, performance, and reliability
Sigrity Serial Link Analysis
Check the compliance of all sections of multi-gigabit serial links to confirm that your product will perform to specification
Link – www.cadence.com